About this product
| Product Information | |
| The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer. | |
| Product Identifiers | |
| Publisher | Springer |
| ISBN-10 | 0442015054 |
| ISBN-13 | 9780442015053 |
| eBay Product ID (ePID) | 997790 |
| Product Key Features | |
| Format | Hardcover |
| Publication Year | 1994 |
| Language | English |
| Dimensions | |
| Weight | 62.8 Oz |
| Width | 6in. |
| Length | 9in. |
| Additional Product Features | |
| Number of Volumes | 1 Vol. |
| Dewey Edition | 20 |
| Table of Content | Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index |
| Illustrated | Yes |
| Dewey Decimal | 671.5/6 |
| Copyright Date | 1994 |
| Author | John H. Lau, Harold S. Morgan, Steven N. Burchett, Darrel Frear |
| Lc Classification Number | Qa75.5-76.95 |
| Lccn | 93-030138 |